JPH0523871B2 - - Google Patents

Info

Publication number
JPH0523871B2
JPH0523871B2 JP23756485A JP23756485A JPH0523871B2 JP H0523871 B2 JPH0523871 B2 JP H0523871B2 JP 23756485 A JP23756485 A JP 23756485A JP 23756485 A JP23756485 A JP 23756485A JP H0523871 B2 JPH0523871 B2 JP H0523871B2
Authority
JP
Japan
Prior art keywords
soldering
soldered
molten solder
thin metal
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP23756485A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6297763A (ja
Inventor
Mitsuo Zen
Juji Kawamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP23756485A priority Critical patent/JPS6297763A/ja
Publication of JPS6297763A publication Critical patent/JPS6297763A/ja
Publication of JPH0523871B2 publication Critical patent/JPH0523871B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP23756485A 1985-10-25 1985-10-25 はんだ付け方法および装置 Granted JPS6297763A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23756485A JPS6297763A (ja) 1985-10-25 1985-10-25 はんだ付け方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23756485A JPS6297763A (ja) 1985-10-25 1985-10-25 はんだ付け方法および装置

Publications (2)

Publication Number Publication Date
JPS6297763A JPS6297763A (ja) 1987-05-07
JPH0523871B2 true JPH0523871B2 (en]) 1993-04-06

Family

ID=17017181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23756485A Granted JPS6297763A (ja) 1985-10-25 1985-10-25 はんだ付け方法および装置

Country Status (1)

Country Link
JP (1) JPS6297763A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2517469B2 (ja) * 1990-10-12 1996-07-24 三洋電機株式会社 半田付方法

Also Published As

Publication number Publication date
JPS6297763A (ja) 1987-05-07

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